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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 79 (1996), S. 4087-4095 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The use of "Kissinger'' plots to analyze in situ resistance monitoring of thin-film reactions during heating at a constant rate is widely accepted. One obtains the activation energy for diffusion, at least in the case of diffusion-controlled reactions. The aim of this article is to extend the analysis one step further and show that, provided that the thickness of the layers formed is known, the same experimental and analytical techniques may yield the pre-exponential growth factor. The validity of the procedure is demonstrated by comparing the results thus obtained with data from the literature derived by conventional analysis of compound growth during isothermal annealing. Such comparisons have been made for Co2Si, CoSi, CoSi2, Pt2Si, PtSi, Ni2Si, and NiSi formation on undoped polycrystalline Si and single-crystal Si on sapphire substrates with ramp rates ranging from 10−2 °C/s to 102 °C/s. Measurements used both conventional furnace and rapid thermal annealing. In the past, the common practice has been to use the Kissinger method regardless of the sequence of growing phases. However, for phases other than the first one to be formed the direct Kissinger analysis needs to be modified. In the present cases the results obtained by means of an appropriately corrected procedure are not significantly different; that may not always be true. © 1996 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 59 (1986), S. 3458-3466 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The formation of Ni3Si2 from the reaction of Ni2Si with NiSi, and that of Pt6Si5 from the reaction of Pt2Si with PtSi have been investigated by Rutherford backscattering, x-ray diffraction, resistance measurements, and optical and electronic microscopy. Standard x-ray diffraction patterns were calculated for Pt6Si5 and for the high-temperature form (hexagonal) of Pt2Si. These are shown to match experimental diffraction patterns. Both Ni3Si2 and Pt6Si5 form quite suddenly (at 470 and 535 °C, respectively) according to the pattern of nucleation-controlled reactions which are anticipated when the free energies of formation of the new phases are sufficiently small. These observations are discussed with respect to the absence of both Ni3Si2 and Pt6Si5 from the sequence of phases which form when Ni and Pt thin films react with Si. Resistivity measurements are reported for Ni3Si2, Pt6Si5, and for the two forms (low and high temperature) of Pt2Si.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 59 (1986), S. 177-180 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Solid solutions of CoSi2 and NiSi2 were prepared from the solid-state reaction of thin films of Ni-Co alloys with their silicon substrates. The room-temperature resistivity of these silicide solid solutions does not increase parabolically, but (within the sensitivity of the measurements) varies linearly with composition. A model is proposed which explains the very weak alloy scattering on the basis that in these disilicides (a) the d bands are pushed below the Fermi level, (b) conduction occurs mostly via s electrons, and (c) there is no s-d scattering.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 67 (1990), S. 241-246 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The structure of zirconium silicide (ZrSi2, orthorhombic C49; a=0.369 nm, b=1.47 nm, c=0.366 nm) thin films has been investigated by high-resolution electron microscopy. The crystals are heavily faulted in the 010 plane with an average distance between faults of 1.6 nm. The fault has been found to be a π/2-rotation twin around the b axis, the habit plane lying between two silicon layers. The crystals contain an equal number of 〈a〉- and 〈c〉-oriented slabs, giving rise to a strained lattice with an average a=c lattice parameter. On the basis of an elastic calculation, the fault energy is evaluated to be of the order of 5 ergs cm−2. This low energy explains the tendency to form polytypes which are mostly disordered, although some ordered sequences are favored at short range.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 65 (1989), S. 567-574 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Oxygen behavior during the formation of CrSi2 and TiSi2 was studied using 16O(α,α)16O resonant scattering and mass dispersive recoil detection analysis. The Ti and Cr films were deposited by e-beam evaporation in a cryopumped system. The oxygen content in the films was varied by evaporating at different pressures. The silicide films were formed by solid-solid reaction of the metal layers with the silicon substrate, and the annealing conditions were such that both partly and fully reacted silicides were obtained. The extent of the silicide formation was monitored by backscattering spectrometry. In the case of CrSi2, oxygen was found to be uniformly distributed throughout the silicide layer after annealing. For the Ti/TiSi2 system, however, oxygen seems to have preferentially remained in the Ti layer during the silicide growth, and its final distribution was confined in a region in the silicide close to the surface. It was also observed in the latter case that silicon diffused to the surface at the initial stage of annealing. A model based on the Nernst–Einstein equation is proposed to provide a general explanation for the oxygen behavior in metal/silicon systems. In addition, it was shown that oxygen which was initially in the form of metal oxides and in solid solution had been transformed into SiO2 after the silicide formation. Oxygen loss is observed for all samples, and increases with the extent of annealing.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 63 (1988), S. 5335-5345 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Gallium, Sb, and Ge were implanted into thick (about 400 nm) layers of TiSi2 prepared by metal-silicon reaction. The diffusion of the implanted atoms was analyzed by means of secondary ion mass spectrometry. Gallium was introduced because a former study had shown that the usual p-type dopant B does not diffuse in TiSi2. Germanium was used in lieu of a Si tracer. Its diffusion characteristics are compared to those of P and As (as well as Si) which had been investigated previously. Germanium and Ga diffuse readily above 600 °C, but Sb does not. Its diffusion appears to be limited to grain-boundary effects. Accumulations of the diffusing atoms are observed (except for Sb) at the silicide-silicon interface. These are due to kinetic effects, namely fast diffusion at grain boundaries and interfaces, rather than to real adsorption which is an equilibrium condition. Because diffusion in intermetallic compounds has been shown to be significantly affected by variations in stoichiometry, experiments were conducted with films implanted not only with foreign atoms but with Ti as well. These did not lead to significantly different observations.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 61 (1987), S. 2203-2211 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The preparation of TaSi2-WSi2 alloys from the reaction of Si with Ta-W films allows one to explore the constitution diagram of the TaSi2-WSi2 pseudobinary system. The structure of the alloys has been investigated by means of Rutherford backscattering, x-ray diffraction, and transmission electron microscopy. The "equilibrium'' phase diagrams for the system TaSi2-WSi2 and for TiSi2-WSi2 are compared in light of simple ideas of alloy theory based on the consideration of the electron to atom ratios. The resistivity of the alloys is analyzed in terms of what has been established about the transport properties of the disilicides and of possible contributions of structural defects, mostly stacking faults, to scattering processes.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 90 (2001), S. 6409-6415 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The formation of C54 TiSi2 using Ti–Nb alloys deposited on polycrystalline Si substrates was studied by means of in situ x-ray diffraction and resistance measurements during temperature ramping. Alloys with Nb contents ranging from 0 to 13.6 at. % were used. The formation temperature of C54 TiSi2 was reduced in the presence of Nb. However, the addition of Nb in Ti did not cause fundamental changes in the evolution of resistance versus temperature. This latter observation suggests that the mechanism for the formation of C54 TiSi2 remained the same in spite of the enhancement effect. For alloys with up to 8 at. % of Nb, the C49 TiSi2 phase formed first, as with pure Ti. When annealing the alloy with 13.6 at. % Nb, neither C49 TiSi2 nor C54 were found in the usual temperature ranges, instead, C40 (Nb,Ti)Si2 was observed. This phase transformed to C54 (Nb,Ti)Si2 above 950 °C. The apparent activation energy associated with the formation of C54 TiSi2 was obtained by annealing the samples at four different ramp rates from 3 to 27 K/s; it decreased continuously from 3.8 to 2.5 eV with increasing Nb content from 0 to 8 at. %. The apparent activation energy for the formation of C40 (Nb,Ti)Si2 was found to be 2.6 eV. The possible physical meaning, or lack thereof, of the high activation energies derived from experimental measurements is extensively discussed. A qualitative model is proposed whereby nucleation would be rate controlling in pure TiSi2, and interface motion in samples with 8 at. % Nb. © 2001 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 87 (2000), S. 8216-8217 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The report that during the formations of the isomorphous CoSi2 and NiSi2 the dominant diffusing species are different is questioned. Not only does this contradict previous results obtained with inert gas markers, but it is based on experiments carried out with Ta markers that are not inert. The problem of using markers in determining the dominant diffusing species during thin film reactions is briefly analyzed. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 59 (1986), S. 2773-2776 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Titanium interaction with phosphorus-doped polycrystalline silicon gate electrodes was investigated by cross-sectional transmission electron microscopy and correlated with sheet resistance measurements. Phosphorus concentration above 1×1016 ion/cm2 in the polycrystalline silicon leads to decreased TiSi2 formation, discontinuous metal silicide layer, and increased sheet resistance. A possible cause could be the formation of titanium phosphide at high phosphorus concentration in the polycrystalline silicon, competing with the total titanium available for silicide formation.
    Type of Medium: Electronic Resource
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