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  • 11
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A nonselective epitaxial growth process for heterojunction bipolar transistors has been studied. The difference in growth rates for epitaxial and polycrystalline films could be used to monitor the thickness of the intrinsic and extrinsic base layers. The films were grown using chemical vapor deposition on Si 〈100〉 (epitaxy) and on silicon dioxide (polycrystalline) at reduced pressure (20–80 Torr) for undoped and in situ B or As doping. The depositions were carried out using silane diluted in hydrogen. Diborane and arsine were used as the source gas for dopants. For the undoped Si films, the deposition of polycrystalline films had a substantially higher rate than that of epitaxial ones. The growth rate of both epitaxial and polycrystalline depositions decreased with increasing total pressure. It was, however, linearly proportional to the silane partial pressure, pSiH4. The dependence of the growth rate on the hydrogen partial pressure was proportional to pH2−0.82 for epitaxial and to pH2−0.60 for polycrystalline depositions. The apparent activation energy was 2.1 and 1.6 eV for the epitaxial and polycrystalline depositions, respectively. A growth mechanism assuming the dissociative adsorption of silane on the Si surface, in combination with first-order hydrogen desorption kinetics, was employed to describe the experimental observations, including the differences in deposition rates, dependency on the hydrogen partial pressure as well as apparent activation energy. In situ B doping influenced neither the epitaxial nor polycrystalline depositions. In situ As doping, on the other hand, largely reduced the growth rate compared to the undoped films to such an extent that there was no appreciable difference in growth rate between the epitaxial and polycrystalline Si. The doping concentration in the epitaxial B and As films were of the order of 1018 cm−3, identical deposition conditions yielded a 5 and 20 times larger dopant incorporation in the B and As doped polycrystalline films, respectively. © 2000 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 12
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 88 (2000), S. 6403-6407 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We observed a violation of the normal Raman selection rule in the resonant Raman spectra of interface (IF) phonon modes of the ultrathin (GaAs)4/(AlAs)2 superlattice. Contrary to the prediction of conventional theories, all four IF modes were observed in both (XX) and (XY) geometries. The result can be interpreted as a consequence of the deep penetration of the electron wave function in the GaAs wells into the AlAs barriers and a lack of definite parity of the electron wave function. Furthermore, our result indicates that conventional theory for bulk (thicker) systems may need to be modified and further developed to be applicable to ultrathin systems. © 2000 American Institute of Physics.
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  • 13
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 89 (2001), S. 1641-1646 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Backscattering and diffraction results are presented for the effects of an interfacial or a surface Mo layer on the formation of Ti-silicides during solid-state interaction between Ti films and Si substrates. It is shown that the interfacial and surface Mo are fundamentally different in their involvement in the Ti-silicide formation. The interfacial Mo induces the formation of C40 (Mo,Ti)Si2 at the interface adjacent to the Si substrate already after annealing at 550 °C, in agreement with our previous results. Hence, the desired C54 TiSi2 can grow directly on top of the C40 (Mo,Ti)Si2 at relatively low temperatures as a result of the template effect. The surface Mo is, however, found in a metal-rich silicide presumably (Mo,Ti)5Si3 at 550–600 °C, which eventually converts to (Mo,Ti)Si2 upon annealing at higher temperatures. Underneath this metal-rich silicide lies a fully developed C49 TiSi2 layer. Consequently, the formation of C54 TiSi2 in the presence of surface Mo follows the usual path of the C49–C54 phase transition. This important difference in the participation of Mo in the silicide formation spreads doubts about the validity of using interfacial Mo versus surface Mo to study the dominant mechanism(s) responsible for the enhanced formation of C54 TiSi2. © 2001 American Institute of Physics.
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  • 14
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 86 (1999), S. 1970-1973 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The kinetics of hydrogen incorporation in amorphous silicon films were studied. The layers were deposited by low pressure chemical vapor deposition using disilane (Si2H6) and phosphine (PH3). The hydrogen concentration, determined by nuclear resonant reaction analysis, increased with decreasing substrate temperature. In accordance with the reported reduction of hydrogen adsorption in the presence of surface phosphorus, the addition of phosphine to disilane was observed to reduce the hydrogen film concentration. The results are discussed in terms of hydrogen adsorption/ desorption kinetics. The activation energy for hydrogen desorption in an undoped film was 1.8±0.2 eV, in good agreement with previously reported values obtained by surface analysis and desorption studies. When phosphine was added, an increase in activation energy was observed. © 1999 American Institute of Physics.
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  • 15
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The formation of titanium silicides has been studied using simultaneous in situ x-ray diffraction with millisecond time resolution and sheet resistance measurements. The effect of a Mo interposed layer between Ti films and Si substrate was investigated by varying the thickness of the Mo interlayer from 0 (Ti/Si) to 1.8 nm (Ti/Mo/Si). The thickness of Ti was kept to 55 nm for all samples. Both isothermal annealing and ramp annealing in helium were performed in order to study the mechanism of silicide formation. While C49 TiSi2 was the only disilicide found after annealing Ti/Si at 650 °C for 20 min, C54 TiSi2 was readily formed in the presence of Mo. The formation of C49 TiSi2 was not observed with a 1.8 nm thick Mo interlayer. Instead, there was indication that C40 (Mo,Ti)Si2 was formed. In addition, broad diffraction peaks, weak in intensity, could be all assigned to Ti5Si4. However, the presence of Ti5Si4 alone did not induce the formation of C54 TiSi2. Even with a 20 °C increase in isothermal annealing temperature to 670 °C for 20 min, the presence of Mo was found to be a necessity for the formation of C54 TiSi2. When annealed in nitrogen, instead of helium, the formation of surface titanium nitride competes with the formation of silicides. The formation of C54 TiSi2 was even suppressed in the sample with a 1.8 nm Mo interlayer when annealed at 650 °C in nitrogen. The formation of Ti5Si4 and the role it plays in the formation of other silicides (C40, C49, and C54) are discussed on the basis of simple crystallographic considerations. The effect of a Mo interlayer and/or ramp-rate on the formation of C40 (Mo,Ti)Si2 and C49 TiSi2 is discussed in conjunction with variations of the preferential orientation of C54 TiSi2 films. © 1999 American Institute of Physics.
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  • 16
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 91 (2002), S. 4562-4567 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We report on a Raman study of nanocrystalline GaN with the wurtzite structure synthesized by arc plasma method. Resonant Raman scattering is observed using 514.5 nm (2.41 eV) laser excitation, which is near the band gap of the "yellow band" (2.2–2.3 eV). Under such near-resonant excitation, new Raman bands unexpected in an ideal wurtzite GaN crystal were found. The transverse optical modes of A1 (531 cm−1) and E1 (560 cm−1), and the nonpolar modes of E2 [567 cm−1 (high) and 143 cm−1 (low)] normally observed in bulk crystals, were recorded and were observed to be resonantly enhanced. Two new bands (680 and 344 cm−1) were assigned to the inactive optical phonon modes B1 (high) and B1 (low), respectively. A broadband centered at 710 cm−1 was attributed to surface modes of the nanocrystals, providing good agreement with the calculated result based on Fröhlich theory. As a result of this study, Raman scattering of GaN nanocrystals has been characterized. © 2002 American Institute of Physics.
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  • 17
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 76 (2000), S. 2053-2055 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Raman spectra of single-wall carbon nanotubes (SWCNTs) were measured at different temperatures by varying the incident laser power. The elevated temperature of the SWCNTs and multiwall carbon nanotubes (MWCNTs) is confirmed to be due to the presence of impurities, defects, and disorder. The temperature coefficient of the frequency of the C–C stretching mode E2g (GM) and that of the radial breathing mode in the SWCNT were determined to be ∼−0.038 and ∼−0.013 cm−1/K, respectively. It is found that the temperature coefficient of the GM in the SWCNT is larger than that of the MWCNT, highly oriented pyrolytic graphite, and the graphite. This is attributed to the structural characteristic of the SWCNT—a single tubular carbon sheet with smaller diameter. © 2000 American Institute of Physics.
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  • 18
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 76 (2000), S. 1831-1833 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Experimental results are presented for the formation of TiSi2 in the presence of an ultrathin Mo layer deposited either at the interface between Ti and Si or on top of Ti/Si. The formation of C54 TiSi2 is clearly shown to be enhanced with a surface Mo layer, although the effect is less pronounced as compared to the use of an interposed Mo layer. The results can be accounted for with a template mechanism where the formation of C40 (Mo, Ti)Si2 is crucial for the epitaxial growth of C54 TiSi2 atop. Possible grain-size effects on the formation of C54 TiSi2 are also discussed. © 2000 American Institute of Physics.
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  • 19
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 73 (1998), S. 312-314 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The introduction of a thin layer of Al at the interface between Ti films and Si substrates enhances the formation of C49 TiSi2 and retards the transition from C49 to C54. An Al interlayer, 0.64 nm thick, reduces the time required to form C49 TiSi2 isothermally at 500 °C from 14 to 7 min. The C49–C54 transformation temperature is increased from 767 to 853 °C, when heating the samples at a constant ramp rate of 3 K/s. Most of the Al is found toward the interface between a Ti-rich silicide at the surface and TiSi2, rather than at the interface between TiSi2 and the Si substrate. The grain size of the C49 TiSi2 formed in the presence of Al is about five times smaller than that formed on a control sample with pure Ti, indicating that the increased density of grain boundaries in C49 TiSi2 in the presence of Al does not help the C49–C54 transformation. Therefore, the improved thermal stability of C49 TiSi2 is likely to be caused by other factors such as a reduced electron/atom ratio when replacing Si with Al in the disilicide. © 1998 American Institute of Physics.
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  • 20
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 82 (1997), S. 5773-5778 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The oxidation of polycrystalline SixGe1−x films with different compositions (i.e., different values of x) is carried out in pyrogenic steam at 800 °C for various lengths of time. It is found that the oxidation is enhanced by the presence of germanium and that the enhancement effect is more pronounced for the films richer in germanium. A mixed oxide in the form of either (Si,Ge)O2 or SiO2–GeO2 is found at the sample surface if the initial SixGe1−x contains more than 50% of germanium. However, a surface silicon cap layer of about 14 nm is found to have a significant impact on the oxidation of the Si0.5Ge0.5 films; it leads to the growth of about 115-nm-thick SiO2 which is about four times that of the SiO2 resulting from the oxidation of the cap layer itself. On the SixGe1−x films with only 30% of germanium, the SiO2 continues to grow after oxidation for 180 min resulting in 233-nm-thick SiO2 which is about 2.4 times greater than the SiO2 grown on 〈100〉 silicon substrates. Rejection of germanium results in piling up of germanium at the interface between the growing SiO2 and the remaining SixGe1−x. Substantial interdiffusion of silicon and germanium takes place in the remaining SixGe1−x. The experimental results are discussed in terms of thermodynamics and kinetics. © 1997 American Institute of Physics.
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